Carbon Nanotubes for Interconnects: Process, Design and Applications
Springer | Circuits & Systems | August 10, 2016 | ISBN-10: 3319297449 | 70 pages | pdf | 12.59 mb
Editors: Todri-Sanial, Aida, Dijon, Jean, Maffucci, Antonio (Eds.)
Provides a single-source reference on carbon nanotubes for interconnect applications
Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects
Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Number of Illustrations and Tables
34 b/w illustrations, 133 illustrations in colour
Topics
Circuits and Systems
Processor Architectures
Electronic Circuits and Devices

Download File Size:10.14 MB

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