Home| All soft| Last soft| Your Orders| Customers opinion| Helpdesk| Cart

Program Search:


Shopping Cart:




*Note: Minimum order price: €20
We Recommend:

Harsh Environment Electronics Interconnect Materials and Performance Assessment €10 buy download
Ahmed Sharif, "Harsh Environment Electronics: Interconnect Materials and Performance Assessment"
English | ISBN: 3527344195 | 2019 | 400 pages | PDF | 16 MB
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions

This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage.

Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact.

-Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics
-Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature
-Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications
-Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more
-A pivotal reference for professionals, engineers, students, and researchers

Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.



Download File Size:10.26 MB


Harsh Environment Electronics Interconnect Materials and Performance Assessment
€10
Customers who bought this program also bought:

Home| All Programs| Today added Progs| Your Orders| Helpdesk| Shopping cart      





Adobe Acrobat Pro DC 2022 €70


Mathworks MATLAB R2022 €105


Adobe Acrobat Pro DC 2022 for Mac €70






Windows 11 With Office 2021 €168


Adobe Master Collection 2022 €265


CineSamples CineStrings €55






Orchestral Tools TIME micro KONTAKT €40


Steinberg HALion 6.4.0.101 STANDALONE €40


Native Instruments Komplete 12 Ultimate Collectors Edition €50