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ANSYS Electronics Suite 2021 R2 | 13.9 Gb
ANSYS Inc. has announced the availability of the 2021 R2 edition of its ANSYS Electronics Suite of electronics and electromagnetics simulation software solutions.

What's New in Ansys Electronics Desktop 2021 R2 General Electronics Desktop
- Electronics Pro, Premium, Enterprise as the default licensing model
- Additional flexible machine configurations in Ansys Cloud
- license sharing when solving design points from Workbench and optiSlang
- Ensight export support for view orientation, 3D plots, and avz export
- Enhancements to Electronics Desktop integration with optiSlang (linux is Beta)
- largelScale DSO Enhancements
. Ability to run job from compressed project file
. load balancing and automatic retry of failed variations
- Dockable window for display and editing of variables
- Adjustment for display precision of evaluated values
- Support for dBm and dBu units for Electric Fields
- SlURM jobs as a requested user
Granta Materials Data library
- Added temperatureldependent BH curves for over 1000 permanent magnet materials
- Added 69 new frequencyldependent RF absorber material grades from laird
- Added 100 material grades for Jl Mag
- Updated records from Carpenter, Hitachi Metals and Arcelor Mittal
- Updated producer names for consistency, conciseness, rebranding, and acquisitions
HFSS
- Improvements for SBR+
. New volumetric SBR+ for dielectric
. Support for spherical wave expansion (*.swe) file import
. Official release of SBR+ parametric antenna arrays
. Support for RangelDoppler data file export in lSlDSO
. Ability to use antenna blockage with SBR+ regions in hybrid designs
- Improved organization of solution types and related settings
- Enhancements to Mesh Fusion setup and meshing process (Beta)
- New option for enhanced low frequency accuracy
- Ability to define custom layout and weights for antenna array postlprocessing
- Improved performance by moving embedded element pattern generation to the solver
- Improved efficiency of field file handling for 3D Component Array and FAlDDM
- Addition of total efficiency and system efficiency as antenna parameters
- New ability to compute DC point using Q3D Extractor (Beta)
- Enhancements to cable modeling workflow and capabilities (Beta, linux only)
- New partial discharge workflow and simulation (Beta)
- Automatic creation of PEC cap for wave ports
- Support for partial derivatives of far fields in tuning Mesh statistics for selected faces
- Mixed (modal and terminal) ports in Transient design (Beta)
HFSS 3D layout
- New Phi Plus HPClenabled meshing for bondwires and 3D CAD (Beta)
- IClonlPackage enhanced automation workflow
- Edit 3D Component definitions from layout
- Filter floating geometry
- Mesh seeding operations on userldefined regions
- Ability to create field plots on clipping planes
- Enhanced multilzone PCB workflow with rigid flex
Maxwell
- Performance Improvements:
. Improved AutolHPC selection for large 3D magnetostatic and eddy simulations
. Acceleration of 2D transient skew simulation by solving slices in parallel
- Enhancements to the AlPhi transient solver
- Enhancements to the AC conduction solver (Beta)
- New nonlinear impedance boundary for 3D transient
- Support for anisotropic linear elastic properties for mechanical coupling
- Ability to define multiple demagnetization curves at different temperatures
- Support for Vltype and userldefined skew types in 2D transient
- Ability to save and plot fields on any slice for skew models in 2D transient
- Enhancements to electric machine toolkit workflows and performance
- Addition of wireless power transfer system components to 3D Component library
- New switched reluctance motor circuit model that includes phase mutual effects
- Ability to select individual objects for loss output in 2D and 3D transient
- Improved robustness of Simulink colsimulation
- Ability to set window options for discrete Fourier transform of harmonic force
- New field line trace plot for E fields in electrostatic
- Ability to use Phi mesh for layered structures
Icepak
- Improved performance through lightweight CAD meshing
- Ability to import Chip Thermal Models
- New lPV ROM creation
- Enhanced device filtering for PCBs
- New features added from Classic Icepak:
. Joule heating
. PCB and Package bool ECAD support
. Mass flow for openings
. Recirculating openings
. Failed fan support
. Mesh settings and operations
- Improved mesh reliability and performance
- Enhanced reporting of heat flow quantities
- Ability to turn monitor point plots on and off
Mechanical
- New Structural solution type (Beta)
- Support for MechanicallThermal stress analysis (Beta)
- Now available in Ansys Cloud
- Support for temperatureldependent materials
- Ability to model surface heat in heat flux excitations
Q3D Extractor
- New PRIME meshing for AClRl solutions
- Improved accuracy and convergence of CG solutions
- Ability to plot electric fields on surfaces
Circuit
- Ansys FilterSolutions
. New product for filter synthesis
. launched from Electronics Desktop
. Ability to export designs to HFSS and Circuit
- Nexxim
. Support for RlGC statelspace fitting for Q3D
. Integration of SPISim IBIS and NPort spec modeling
. SVPWM source in Power Electronics component library
. ISO7637 EFT source in Circuit EMC component library
EMIT
- Results View Enhancements
. Multiple result views
. Edit the scenario while viewing the current results
. Compare results across different scenarios
. Save results for future reference
- Imported Emitter Spectrums
. Import CSV file with data in either the time or spectral domain
. Configurable FFT and windowing parameters
. Automatically extracts narrowband components
. Support for smoothing the broadband spectrum
. Raw data overlaid on the plots

Twin Builder

Modelica Workflow Enhancements
- Ability to extend models & templates
- Support for Win32 platform binaries (FMU) export
ROMs and ROM Viewer Enhancements
- Support for fields as input parameter in Static ROM Builder
- ROM Builders/Viewer now supports point probes
- New ROM ribbon for easy ROM access in Twin Builder
- Support for field snapshot images of ROMs on Schematic
- Ability to compare transient ROM field to reference field in Dynamic ROM Builder
- Ability to modify a plot's legend, line styles, and colors in ROM Builders/Viewer
- Ability to copy image to clipboard with rightlclick
- Support for Von Mises stress as postlprocessing in Static ROM Builder
Export, Deployment and Digital Twins
- New user library in Twin Deployer
- Support for Parametric sweep in Twin Deployer
- ROM Viewer integration in Twin Deployer
- Alllinclusive Colsimulation FMU for linux
library/Solver Enhancements
- linux Solver Porting now also supports Clmodels
- Ability to model capacity fading effect in Battery models
UI/UX Enhancements
- New HFSS Dynamic link with Push Excitation
- New Python Component in Twin Builder to run Python scripts
- New IronPython Script Editor in Twin Builder
- Equations are now also supported in copy/paste data on Schematic Editor
- Improved Schematic ribbon interface

Selected Defect Corrections

Circuit
- 420947 Y/Z matrix values are now renormalized correctly when exported
EMIT
- 421646 Component editor now works when the default length unit is set to mils
- 431519 External files used in EMIT components are now included in the project archive
HFSS
- 353931 Parametric array element and array pattern is now correct when changing component variable
- 434418 Mesh refinement is now accurate when there are more than 25 excitations for 3D component array
- 435788 VRT is now correct for current source antennas in relative coordinate system
Icepak
- 143708 Parity in serial and parallel solver convergence for designs including network boundaries
- 363841 Simulation results are accurate when restarting solutions for designs using the Ray Tracing radiation model
- 366008 Volumetric flow post processing is now available
- 412012 Pressure drop estimation is now accurate while using the grille boundary with loss curve definition
Maxwell
- 377569 Resoved the hanglon issue on linux related to induction machine ECE model
Mechanical
- 396214 Solution now invalidates for AmbientTemp changes referenced in BCs
Q3D Extractor
- 342696 Resolved OSldependent mesh differences
× ANSYS Electronics Suite 2021 R2 Close
× ANSYS Electronics Suite 2021 R2 Close
ANSYS Electronics Desktop is a comprehensive platform that enables electrical engineers to design and simulate various electrical, electronic and electromagnetic components, devices and systems. It is a unified interface which creates and analyzes electromagnetic (EM), thermal and circuit designs.

Engineers can access goldlstandard tools such as ANSYS HFSS, ANSYS Maxwell, ANSYS Q3D Extractor and ANSYS Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, the Electronics Desktop includes direct links to the full ANSYS portfolio of thermal, fluid and mechanical solvers for comprehensive multiphysics analyses.

Engineers can integrate rigorous 2D and 3D physics analyses with system and circuit simulations, all inside a single framework called ANSYS Electronics Desktop. Any combination of products within the Electronics Desktop can be inserted into a single project. For instance, you can combine disparate design types such as HFSS, Circuit and Icepak into a single project. Schematics can be used to wire up different field solver models and create a model of a highllevel system through dynamic links that combine 3D EM and SPICE circuit analyses.

Engineers can efficiently manage complex projects that require several different analysis tools to predict the operation of their electronic products. Designs can also be parameterized. With Optimetrics, design variations can be studied and made available to other modules when the designs are included in a higherllevel simulation. This allows engineers to conduct whatlif experiments and study the effects of component design parameter variations on the behavior of the entire system.


Founded in 1970, ANSYS employs nearly 3,000 professionals, many of whom are expert M.S. and Ph.D.llevel engineers in finite element analysis, computational fluid dynamics, electronics, semiconductors, embedded software and design optimization. Our exceptional staff is passionate about pushing the limits of worldlclass simulation technology so our customers can turn their design concepts into successful, innovative products faster and at lower cost. As a measure of our success in attaining these goals, ANSYS has been recognized as one of the world's most innovative companies by prestigious publications such as Bloomberg Businessweek and FORTUNE magazines.

Product: ANSYS Electronics
Version: 2021 R2 Suite with Local Help
Supported Architectures: x64
Website Home Page : www.ansys.com
language: english
System Requirements: PC *
Size: 13.9 Gb

* System Requirements: Platform Support

Defining the optimum computer infrastructure for use of Ansys software begins with understanding the computing platforms that are tested and supported by Ansys. Download the link below to learn about the computing platforms we support as well as reference system architectures recommended by valued partners.

The PDF files below provide platform support information for the current Ansys release, including certification and test information for operating systems, graphics cards, job schedules and other platform components.

Platform Support
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